JPH0561780B2 - - Google Patents

Info

Publication number
JPH0561780B2
JPH0561780B2 JP19931687A JP19931687A JPH0561780B2 JP H0561780 B2 JPH0561780 B2 JP H0561780B2 JP 19931687 A JP19931687 A JP 19931687A JP 19931687 A JP19931687 A JP 19931687A JP H0561780 B2 JPH0561780 B2 JP H0561780B2
Authority
JP
Japan
Prior art keywords
insulating substrate
bottom plate
side wall
metal bottom
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP19931687A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6442843A (en
Inventor
Yukio Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP19931687A priority Critical patent/JPS6442843A/ja
Publication of JPS6442843A publication Critical patent/JPS6442843A/ja
Publication of JPH0561780B2 publication Critical patent/JPH0561780B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP19931687A 1987-08-10 1987-08-10 Semiconductor device Granted JPS6442843A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19931687A JPS6442843A (en) 1987-08-10 1987-08-10 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19931687A JPS6442843A (en) 1987-08-10 1987-08-10 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS6442843A JPS6442843A (en) 1989-02-15
JPH0561780B2 true JPH0561780B2 (en]) 1993-09-07

Family

ID=16405776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19931687A Granted JPS6442843A (en) 1987-08-10 1987-08-10 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6442843A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2793330B2 (ja) * 1990-06-11 1998-09-03 株式会社東芝 封止型ハイブリッド回路装置
JP3550243B2 (ja) * 1996-01-30 2004-08-04 株式会社東芝 内部圧接型半導体装置
JP6065089B2 (ja) * 2015-11-05 2017-01-25 住友電気工業株式会社 半導体モジュール

Also Published As

Publication number Publication date
JPS6442843A (en) 1989-02-15

Similar Documents

Publication Publication Date Title
US5175612A (en) Heat sink for semiconductor device assembly
JP6093455B2 (ja) 半導体モジュール
US10959333B2 (en) Semiconductor device
KR19980058198A (ko) 버텀리드 반도체 패키지
JP2013258334A (ja) 半導体装置及びその製造方法
JP2008141140A (ja) 半導体装置
US4712127A (en) High reliability metal and resin container for a semiconductor device
JPH06177295A (ja) 混成集積回路装置
US5796160A (en) Resin-sealed semiconductor device
JPH0561780B2 (en])
JPH07263618A (ja) 混成集積回路装置
KR100244826B1 (ko) 반도체장치 및 그 제조방법
JP2004273946A (ja) 半導体装置
JP4060020B2 (ja) 半導体装置
JPS6311735Y2 (en])
JPS6127909B2 (en])
JPH0778921A (ja) 半導体装置
JPH06334070A (ja) 混成集積回路装置
JP2551349B2 (ja) 樹脂封止型半導体装置
JPH027469Y2 (en])
JPH03101256A (ja) 半導体装置
JPH05166963A (ja) 半導体装置
JPH01179439A (ja) 樹脂封止形半導体装置
JPH0831986A (ja) 放熱板付半導体装置
JPS6311733Y2 (en])

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees